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Bostik - Bostik D-332 Premium Wood Flooring Adhesive Product Demo

Bostik D-332 Premium Wood Flooring Adhesive Features

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    • Moisture Cure Urethane Adhesive: As a one-part moisture cure urethane adhesive Durabond D-332 Premium Wood Floor Adhesive is easy to work with. Once cured, Durabond D-332 is not affected by exposure to moisture and its superior elastomeric properties provide a tough flexible and tenacious bond, allowing the adhesive to move with the wood when it expands and contracts.
    • Suitable Wood Types: D-332 may be used to adhere all engineered, acrylic impregnated, solid plank-flat milled, shorts, bamboo, cork, and parquet hardwood flooring designed and recommended in writing by the hardwood flooring manufacturer for glue-down applications. This adhesive can also be used to install plywood as described, as well as, ceramic tile, marble, and stone inlays for light commercial and/or residential applications.
    • On, Above or Below Grade: D-332 can be used for on, above or below grade installations. You should always refer to the Wood Flooring Manufactures recommendations before installing your hardwood floor
    • Suitable Substrates: Excellent for use over all subfloors common to hardwood flooring installations including: concrete, plywood, particle or chip board (underlayment grade), well bonded vinyl and ceramic tile, cement backer board, gypsum patch/underlayments (dry, above-grade), cement patch underlayments, radiant heat flooring and terrazzo. Also the perfect choice for more difficult subfloors such as gypsum patch or underlayments; however this type of installation should be done in dry above grade areas only.
    • Antimicrobial Protection: D-332 contains Bostik’s BLOCKADE antimicrobial protection, which inhibits the growth of bacteria, mold, or mildew on the surface of the dried adhesive; the dried adhesive resists stains caused by mold.
    • L.E.E.D Compliant: D-332 is VOC Compliant and may contribute to the qualification of a product for LEED certification under Indoor Air Quality Section 4.1- Low Emitting Materials for Adhesives and Sealants as specified in the Green Building Rating System V.2.1.

 

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